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Engineered for precise, clamp-free flattening of highly warped glass substrates and seamless integration with existing fab metrology, lithography, and inspectionEngineered for precise, clamp-free flattening of highly warped glass substrates and seamless integration with existing fab metrology, lithography, and inspection

CoreFlow Unveils NEW 310 mm × 310 mm Vacuum Stage to Solve Major Warpage Challenges in CoPoS Panel-Level Packaging

Yazar: AI JournalKaynak: AI Journal
2025/12/17 01:16
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Engineered for precise, clamp-free flattening of highly warped glass substrates and seamless integration with existing fab metrology, lithography, and inspection systems

DALIAT-EL CARMEL, Israel, Dec. 16, 2025 /PRNewswire/ — CoreFlow Ltd., a global provider of high-accuracy aerodynamic handling solutions for the semiconductor industry, today announced its next-generation Vacuum Stage for warped panel handling and flattening, designed for advanced CoPoS (Chip-on-Panel-on-310 mm × 310 mm substrate) packaging processes.

 CoPoS substrates provide up to 81% more usable area compared to traditional 300 mm wafers, supporting higher device density and improved manufacturing efficiency for advanced AI-driven applications.

Derived from CoreFlow’s fab-proven vacuum chucks currently used in 300mm wafers CoPoW process flows, the new 310 mm × 310 mm stage is designed to support next-generation CoPoS panel-level packaging requirements.

Industry Leadership Perspective

“Substrate warpage has become one of the industry’s most critical manufacturing challenges,” said Alon Segal, CEO of CoreFlow. “Building on our fab-proven experience with silicon wafers and glass substrates, the new 310 mm × 310 mm PLP vacuum stage integrates advanced aeromechanical design for accurate, clamp-free flattening. With interfaces compatible with standard fab utilities, the stage supports efficient integration into existing metrology, lithography, and inspection systems for advanced CoPoS panel-level packaging.”

The new 310 mm × 310 mm stage is now available for order in Selective Vacuum or GripJet configurations, with optional surface finishing, ESD coating, and lift-pin assemblies. Customer-specific modifications are supported, with typical delivery lead times of 8–12 weeks.

About CoreFlow Ltd.

CoreFlow Ltd. (www.coreflow.com) is an leading developer and manufacturer of advanced substrate-handling systems for the semiconductor, FPD & Solar industries. Founded in 1999, CoreFlow has been at the forefront of aeromechanical innovation, with patented handling technologies deployed globally. The company’s headquarters and R&D center are located in Daliat-El Carmel, Mt. Carmel, Israel, with manufacturing, sales, and customer-support operations in Korea, Taiwan, Japan, and China.   

For more information or to schedule a technical briefing, please contact [email protected] or [email protected] or our local distributors.

Media & Sales Contacts:

Photo – https://mma.prnewswire.com/media/2846840/CoreFlow_Selective_Vacuum.jpg

Cision View original content to download multimedia:https://www.prnewswire.com/news-releases/coreflow-unveils-new-310-mm-O-310-mm-vacuum-stage-to-solve-major-warpage-challenges-in-copos-panel-level-packaging-302643721.html

SOURCE CoreFlow Ltd

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